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D2655 SINGLE COMPONENT MOISTURE CURING LAMINATING ADHESIVE

Update: 19-11-22 18:53       View:
　　
DESCRIPTION
D 2655 is a single component moisture curing urethane adhesive. It has been developed primarily for applications in
the laminating and panel manufacturing industries where it is used for bonding foam insulating materials, and
honeycomb etc., to a wide variety of plastics, metals and woods.

PRODUCT APPLICATION
Economical:  Its ease of spreading, high solids content and one way stick characteristics ensure fast, low cost coverage.
Strong, resilient, flexible bond:  Besides the diversity of the materials that can be bonded, the cured adhesive exhibits excellent flexibility and resistance to heat, cold, moisture and solvent. 
Resistance to high and low temperatures: The bond line will withstand wide temperature ranges (-40 ° C to+140°C) for extended periods without loss of strength.

2556.2DS
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